Invensas Corporation, a leading provider of semiconductor technology solutions and wholly owned subsidiary of Tessera Technologies, Inc. (Nasdaq: TSRA), will demonstrate recent advancements and customer applications in Multi-Die Face-Down (xFD
) technology at the Intel Developer Forum (IDF), Moscone Center West, San Francisco, Sept. 11-13, 2012.
To be exhibited:
- Netlist Inc., a leading provider of high performance memory modules, introduces Dual Face Down (DFD TM) DDR3/DDR4 components into their Hypercloud TM platform for servers, workstations and high-performance computing.
- DIMM-IN-A-PACKAGE TM, the groundbreaking solution for Ultrabooks TM and Tablets, which has now gained initial Original Equipment Manufacturer (OEM) adoption and will replace bulky Dual Inline Memory Modules (DIMMs) with much smaller, cheaper and more power efficient semiconductor packages.
- 3D Through Silicon Via (TSV), and mobile memory solutions, including Bond Via Array (BVA), high-bandwidth package-on-package (PoP) solution for next generation Smartphones and handheld devices, are displayed.
“We are delighted to have the opportunity at IDF to discuss and showcase the pioneering solutions we have been introducing to the server, mobile and personal computing segments over the past few months, and we are excited that OEMs, Original Design Manufacturers (ODMs), and other primary semiconductor supply chain partners are adopting these technologies for future product platforms,” said Simon McElrea, president of Invensas. “We look forward to welcoming current and future partners to our booth at IDF.”
Safe Harbor Statement
This press release contains forward-looking statements, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements involve risks and uncertainties that could cause actual results to differ significantly from those projected, particularly with respect to the features, characteristics and benefits of Invnesas products and technology, the participation by Invensas at the Intel Developer Forum and the subject matter of the presentations by Invensas at the forum. Material factors that may cause results to differ from the statements made include the plans or operations relating to the businesses of Tessera Technologies, Inc. (the “Compamy”); market or industry conditions; the expiration of license agreements and the cessation of related royalty income; the failure, inability or refusal of licensees to pay royalties; initiation, delays, setbacks or losses relating to the Company’s intellectual property or intellectual property litigations, or invalidation or limitation of key patents; the timing and results, which are not predictable and may vary in any individual proceeding, of any ICC ruling or award, including in the Amkor arbitration; fluctuations in operating results due to the timing of new license agreements and royalties, or due to legal costs; changes in patent laws, regulation or enforcement, or other factors that might affect the Company’s ability to protect or realize the value of its intellectual property; the risk of a decline in demand for semiconductor and camera module products; failure by the industry to use technologies covered by the Company’s patents; the expiration of the Company’s patents; the Company’s ability to successfully complete and integrate acquisitions of businesses, including the integration by DigitalOptics Corporation (“DOC”) of its recently acquired camera module manufacturing facility in Zhuhai, China; the risk of loss of, or decreases in production orders from, customers of acquired businesses; financial and regulatory risks associated with the international nature of the Company’s businesses; failure of the Company’s products to achieve technological feasibility or profitability; failure to successfully commercialize the Company’s products; changes in demand for the products of the Company’s customers; limited opportunities to license technologies and sell products due to high concentration in the markets for semiconductors and related products and camera modules; the impact of competing technologies on the demand for the Company’s technologies and products; failure by DOC to become a vertically integrated camera module supplier; and the reliance on a limited number of suppliers for the components used in the manufacture of DOC products. You are cautioned not to place undue reliance on the forward-looking statements, which speak only as of the date of this release. The Company’s filings with the Securities and Exchange Commission, including its Annual Report on Form 10-K for the year ended Dec. 31, 2011, and its Quarterly Report on Form 10-Q for the quarter ended June 30, 2012, include more information about factors that could affect the Company’s financial results. The Company assumes no obligation to update information contained in this press release. Although this release may remain available on the Company’s and Invesas’ website or elsewhere, its continued availability does not indicate that the Company is reaffirming or confirming any of the information contained herein.