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FEI Launches New Helios NanoLab HP Platform For High Productivity TEM Sample Preparation

HILLSBORO, Ore., Aug. 28, 2012 (GLOBE NEWSWIRE) -- FEI (Nasdaq:FEIC), a leading instrumentation company providing imaging and analysis systems for research and industry, today announced new Helios NanoLab™ DualBeam™ systems for engineers that need to make vital process improvement decisions. The 450HP and 1200HP DualBeam systems include new capability that meets the critical requirements for semiconductor process development at the 28nm device geometry node and below.

"Developing new processes and technologies that include shrinking geometries, new materials and novel device architectures and ramping those processes to high-volume production quickly are driving unprecedented increases in the demand for TEM analysis," stated Rudy Kellner, vice president and general manager, Electronics Business Unit, FEI. "TEM samples must be ultra-thin, of the highest quality, and generated in a routine and consistent manner across a fleet of tools. Typically, as samples get thinner, the difficulty becomes time to results, operator skill level and subtle differences among equipment. We have designed the 450HP and 1200HP systems to overcome these issues. Ultimately, the system's ability to yield more good samples at double the throughput allows for potentially significant reductions for both the time-to-answer and the cost-per-answer."

The Helios NanoLab 450HP and 1200HP DualBeam systems can prepare 15nm thick samples with less than a 2nm damage layer in 90 minutes, two times faster than competitive alternatives. iFast™ automation software maximizes ease-of-use while ensuring consistency among multiple operators and systems. QuickFlip grid holders facilitate inverted sample preparation to improve sample quality while maintaining high throughput. Cell Navigation software allows automated navigation within non-unique memory arrays that can locate a single designated bit cell in a 50nm lateral field. Together, these features enable a robust process to prepare high quality, ultra-thin lamella across multiple tools in a consistent manner—independent of operator skill level.

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