HILLSBORO, Ore., Aug. 28, 2012 (GLOBE NEWSWIRE) -- FEI (Nasdaq:FEIC), a leading instrumentation company providing imaging and analysis systems for research and industry, today announced new Helios NanoLab™ DualBeam™ systems for engineers that need to make vital process improvement decisions. The 450HP and 1200HP DualBeam systems include new capability that meets the critical requirements for semiconductor process development at the 28nm device geometry node and below.
FEI Launches New Helios NanoLab HP Platform For High Productivity TEM Sample Preparation
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