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Power density and light-load efficiency improvement are key issues for server, telecom and AC-DC power designers. Additionally, the synchronous rectification in these switch-mode power supplies (SMPS) designs require cost-effective power supply solutions that minimize board space while increasing efficiency and reducing power dissipation. Fairchild Semiconductor (NYSE: FCS) helps designers meet these power design challenges with the expansion of the
PowerTrench® MOSFET family.
Part of the mid-voltage power MOSFET portfolio, these devices are optimized power switches that combine a small gate charge (Q
G), a small reverse recovery charge (Q
rr) and a soft-reverse recovery body diode, allowing for fast switching speeds. Available in a 40V, 60V and 80V rating, these devices require less power dissipation in the snubber circuitry due to an optimized soft-body diode that reduces voltage spikes by up to 15 percent over the competitor’s solution.
Employing a shielded-gate silicon technology that provides charge balance, the devices achieve higher power density, low ringing and better light-load efficiency. By using this technology, the devices achieve a lower figure of merit (Q
G x R
DS(ON)) while reducing driving loss to increase power efficiency.
The first devices available include the 40V
FDMS015N04B and 80V
FDMS039N08B available in a Power56 package, and the 60V
FDP020N06B and 80V
FDP027N08B available in a TO-220 3-lead package.
Features and Benefits:
Smaller package size (Power56 and TO-220 3-lead) with maximum thermal performance to system size
Lower Q G to reduce gate driving loss
Low Q GD/Q GS ratio to prevent undesirable turn-on improving system reliability
Low dynamic parasitic capacitances to reduce gate driving loss for high-frequency applications
100% UIL tested
The addition of these new PowerTrench MOSFETs enhances Fairchild’s mid-voltage MOSFET offering. The devices are part of the comprehensive PowerTrench technology portfolio and are instrumental in achieving higher energy efficiency by meeting the electrical and thermal performance requirements for today’s electronics.