In November, we acquired Spark from Nanda Technologies, which is a new approach to inspection. Conditional macro inspection tools, scan across the wafer with a very small view of collection, making them very slow creating a trade-off we need to make between what sort of speed do you want versus what’s the level of sensitivity that you want in this brightfield only.
The Nanda tool approaches it completely differently by basic illuminating and capturing the entire wafer in one shot, much quicker, you get the high-sensitivity, high throughput. And it’s both brightfield and darkfield. And where this does, it really bridges the gap between the micro-inspection which is slow but extremely high resolution. The existing macro which is very fast, but limited resolution to what’s a dance macro, which retains the speed and throughput that all macro tools have today but with significantly better sensitivity in the market.
And it’s precisely this advance macro space that in our nine months of OEM has allowed us to see in deep conversations with our customers, new applications where this Spark tool can be used, such as backside inspection which is particularly important with the emergence of EUV, where particles can be a fatal issue in terms of imaging on the wafers, CD mapping which is very complementary to our existing OCD.
And lastly, advanced packaging, where the Spark tool works particularly well in certain elements of the advanced packaging. And we have a tool that’s undergoing qualifications in that particular space right now.Read the rest of this transcript for free on seekingalpha.com
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