Rubicon Technology, Inc. (NASDAQ:RBCN), a leading provider of sapphire substrates and products to the LED, semiconductor, and optical industries, today announced that the United States Patent and Trademark Office (USPTO) has allowed Rubicon’s patent application entitled, “Intelligent Machines and Process for Production of Monocrystalline Products with Goniometer Continual Feedback.” The patent covers Rubicon’s equipment and process developed to perform in-situ orientation of its sapphire crystals within the various fabrication tools used by the Company.
Rubicon’s customers in the LED, SoS/RFIC and optical markets all have specific and distinct requirements for the crystal planar orientation of the sapphire products used in their applications. The new patented orientation technology provides greater precision in sapphire planar orientation and eliminates time-consuming steps by performing the orientation at the fabrication tool. These resulting efficiencies will ultimately translate into savings for Rubicon customers.
“Rubicon is known by many for its expertise in crystal growth technology, but our technological leadership extends from raw material through finished sapphire wafers,” said Raja M. Parvez, President and CEO of Rubicon Technology. “This patent reflects one of many technological innovations we’ve put in place to meet our customers’ exacting and evolving requirements.”
About Rubicon TechnologyRubicon Technology, Inc. is an advanced electronic materials provider that is engaged in developing, manufacturing and selling monocrystalline sapphire and other crystalline products for light-emitting diodes (LEDs), radio frequency integrated circuits (RFICs), blue laser diodes, optoelectronics and other optical applications. The Company applies its proprietary crystal growth technology to produce very high-quality sapphire in a form that allows for volume production of various sizes and orientations of substrates and windows. Rubicon is a vertically-integrated manufacturer with capabilities in crystal growth, high precision core drilling, wafer slicing, surface lapping, large-diameter polishing and wafer cleaning processes, which the Company employs to convert the bulk crystal into products with the quality and precision specified by its customers. The Company is the world leader in larger diameter products to support next-generation LED, RFIC and optical window applications.
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