“The relationship between Bemis and Thinfilm is a clear sign that the printed electronics market is entering a new commercial phase. While vendors have created standalone components, the integrated systems commercialized through this partnership are truly disruptive,” said Dr. Malcolm J. Thompson, founder and Director Emeritus of the FlexTech Alliance. “Vendors who have waited to see what printed and flexible electronics can offer should take this as a strong sign that now is the time to be seriously evaluating the new product opportunities that printed electronics can generate.”The Bemis Intelligent Packaging Platform is expected to be commercially available in 2014.
Bemis Selects Thin Film Electronics To Develop Intelligent Packaging Platform
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