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Ultratech Achieves Advanced Packaging Exclusive And Preferred Tool Vendor Agreements With Top-Tier Global Companies

SAN JOSE, Calif., July 9, 2012 /PRNewswire/ -- Ultratech, Inc. (Nasdaq: UTEK), a leading supplier of lithography and laser-processing systems used to manufacture semiconductor devices and high-brightness LEDs (HB-LEDs), today announced that the company has agreed to 'exclusive supplier' and 'preferred tool vendor' agreements with several top-tier advanced packaging (AP) companies around the world.  Combined, these companies account for almost 60 percent of the electroplated flip chip market that market-leader Ultratech currently addresses.  These agreements, along with the recent acquisition of over 200 U.S. and foreign AP patents, strategically position Ultratech to meet the lithography packaging requirements for the future device nodes of its global customer base.  They additionally underscore Ultratech's ongoing commitment to provide its customers with leading-edge technology solutions and low cost-of-ownership advantages.

Ultratech Vice President, Advanced Packaging Technology/Nanotechnology Markets Manish Ranjan explained, "Ultratech has maintained its leading position in AP for almost 10 years.  Several of our customers have signed multi-year agreements that range from 'exclusive supplier' to 'preferred tool vendor' because they understand the technical and economic advantages our tools deliver for advanced volume manufacturing.  These agreements highlight the close working relationship that Ultratech has with its strategic customers.  These long-term relationships provide valuable insight for the development of market-specific features that enable our customers' next-generation devices.  Building on the recent acquisition of AP patents and the multi-year vendor agreements, Ultratech will continue to work to develop lithography systems that meet its customers' leading-edge, advanced packaging needs."

The AP300 300-mm lithography system is built on Ultratech's customizable Unity Platform , and delivers superior overlay, resolution, and side wall profile performance enabling highly-automated and cost- effective manufacturing of all types of wafer-level packages and is particularly well suited for fan-out configurations and 3D ICs.  In addition, the Company has developed numerous application-specific product features to enable next-generation packaging techniques, such as Ultratech's award winning dual-side alignment (DSA) system, utilized around the world in volume production. 

Details of the AP patents acquisition, along with a full list of the 200 foreign and U.S. patents can be found in Ultratech's 8K filing on Thursday, June 28.  Visit Ultratech's website at:

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