, a leader in fluid dispensing, coating, and jetting technologies, will demonstrate its new, patent pending, NexJet™ jetting system with the Genius™ Jet Cartridge at its first public appearance in the USA at SEMICON West 2012. This innovative technology makes jet dispensing faster, easier, and more intuitive, and reduces cost of ownership by up to 20% over other jets.
At the heart of the system is the one-piece Genius Jet Cartridge. As simple as an ink jet printer cartridge, it is easily removed and replaced in seconds without tools, saving time, money, and labor on the production line. The Genius Jet Cartridge dispenses up to 50 million cycles before a replacement is necessary, depending upon the application. The memory in the Genius Jet Cartridge stores vital usage data that is communicated to the dispensing system and compared to the recipe to notify the operator when the correct cartridge is installed or when it needs replacement. This intelligence enables quality dispensing and high yields. The advanced design of the NexJet system includes new software that widens the process window to ensure stable and repeatable results for high-yield production and broadens the range of jettable fluids and applications.
“Jetting is one of the most popular ways to dispense fluids during production. Nordson ASYMTEK pioneered jetting with the development of the first DispenseJet
series of valves in 1994, and today our jets are installed globally in the widest range of dispensing applications,” said Peter Bierhuis, president, Nordson ASYMTEK. “The new NexJet jet builds upon Nordson ASYMTEK’s foundation of jetting excellence and revolutionizes the construction of the jet itself, setting new standards for ease of use, smart operation, extended capability, and flexibility.”
The NexJet System includes new precision software control of the jetting process, enabling successful results with both low- and high-viscosity fluids, and accommodates a broad range of fluids for applications such as flip chip underfill, chip scale package, ball grid array, package-on-package underfill, precise coating, and adhesive dispensing.