(NASDAQ:RSYS), a leading provider of embedded wireless infrastructure solutions, today announced the
family of ultra-portable COM Express modules, based on third-generation Intel
Core™ i7 processors, to support higher processing and graphics performance for video-intensive applications. The CEQM77 combines quad and dual-core performance, the option for error correcting code (ECC) memory and a ruggedized COM Express module with a -40C to +85C temperature range to meet demanding requirements for embedded technology applications in the aerospace and defense (A&D), medical and enterprise markets.
Within the A&D market, today’s military systems are demanding higher processing and graphics capabilities to ensure optimal situational awareness on the battlefield as well as ECC memory to ensure data integrity for mission critical applications. These consolidated systems must meet stringent size, weight and power restrictions while providing the processing capacity to combine legacy computers that support multiple, high-quality displays. Radisys’ extended-temperature -40C to +85C CEQM77 module with ECC memory is specifically designed and tested to withstand extreme military conditions and meet the processing-intensive needs for these applications.
“The rapid evolution of A&D applications requires us to stay on top of the technology curve and we rely heavily on our suppliers to provide the innovative solutions that will keep us moving forward,” said David Gutman, President and COO,
Tulip Development Labs
, a world class provider of shock, vibration and environmentally-rugged in-vehicle or aircraft mounted LCD displays. “Radisys consistently provides access to the newest silicon offerings on industry-standard COM Express modules, allowing us to offer our customers the performance they need for their mission critical applications, as well as a quick upgrade path without significant engineering costs.”
Supporting the third-generation Intel Core i7 processors such as the quad-core 2.3GHz 3615QE, Radisys’ CEQM77 provides a 20 percent processing performance increase and twofold graphics acceleration over the previous generation module, all while extending the product lifetime and maintaining a smooth upgrade path for previous COM Express based applications.