Amtech Systems To Announce Second Quarter Financial Results On May 10, 2012

TEMPE, Ariz., May 3, 2012 /PRNewswire/ -- Amtech Systems, Inc. (NASDAQ: ASYS), a global supplier of production and automation systems and related supplies for the manufacture of solar cells, semiconductors, and sapphire and silicon wafers, today announced that it will host a conference call to discuss the Company's financial results for the second quarter ended March 31, 2012 on Thursday, May 10, 2012 at 5:00 pm ET. 

Executive Chairman J.S. Whang; President and CEO, Fokko Pentinga; and Executive Vice President & CFO, Brad Anderson will discuss financial results and take questions following the prepared remarks.

The dial-in details for the live conference are as follows:

• USA toll free:             1-877-317-6789
• Canada toll free:         1-866-605-3852
• International:              1-412-317-6789  

A live webcast of the conference call will be available in the investor relations section of the Company's website at: http://www.amtechsystems.com

A telephone replay will be available 1 hour after the end of the conference through May 18, 2012. The dial-in details for the replay are as follows:

• USA toll free:              1-877-344-7529
• International:               1-412-317-0088
• Conference code:        10013678

About Amtech Systems, Inc.

Amtech Systems, Inc. manufactures capital equipment, including silicon wafer handling automation, thermal processing equipment and related consumables used in fabricating solar cells, LED and semiconductor devices. Semiconductors, or semiconductor chips, are fabricated on silicon wafer substrates, sliced from ingots, and are part of the circuitry, or electronic components, of many products including solar cells, computers, telecommunications devices, automotive products, consumer goods, and industrial automation and control systems. The Company's wafer handling, thermal processing and consumable products currently address the diffusion, oxidation, and deposition steps used in the fabrication of solar cells, LEDs, semiconductors, MEMS and the polishing of newly sliced silicon wafers.

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