WLCSP Market & Industrial Trends

NEW YORK, April 24, 2012 /PRNewswire/ -- Reportlinker.com announces that a new market research report is available in its catalogue:

WLCSP Market & Industrial Trends

http://www.reportlinker.com/p0787303/WLCSP-Market--Industrial-Trends.html#utm_source=prnewswire&utm_medium=pr&utm_campaign=Electronic_Component_and_Semiconductor

Growth rate is still high, but the market shows early signs of maturity

Many "WLP" technologies are now cruising at a very high altitude. This is serious business: over 23 billion units packaged with 'fan-in' as we may call it are expected to sell and be mounted in smartphones, tablet PCs or other mobile devices in 2011. For size reduction, together with low cost, remains the main driver for adoption of this technology. If 'fan-in' WLCSP already reached high penetration rates in mobile applications for connectivity (Bluetooth+WLAN+FM combos, GPS) and analog integrated circuits (DC/DC converters, LDO's, ESD/EMI protection devices), it is still growing fast for some other IC types as well as in MEMS and sensors. We are not at a time to claim that "Wafer Level Packaging" is taking off any longer.

Reaching over 2 million 300mm equivalent 'fan-in' WLCSP wafers in 2011 for a total market size of b$1.7

Of course, one may argue that these are tiny devices. Well, if this is true for many of them, it appears that the average size of a 'fan-in' WLCSP device tended to increase over the past 2 years, with many "connectivity" devices reaching sizes of more than 30mm². We estimate that in 2011, more than 2.3 million 300mm equivalent 'fan-in' WLCSP wafers will be processed for the first time. All steps compounded (wafer level, die level and test), we estimate that the 2011 market value of 'fan-in' WLCSP is close to B$ 1.7.

Prices keep on decreasing, but the market growth rate is expected to stay high at 12% over the 2010-2016 time period

Although costs and prices still decrease as the technology and its market mature, the market value growth rate for the 2010-2016 timeframe is still expected around 12%, 4 points higher than semiconductor packaging in general. However, this is lower than the 22% 2008-2013 growth rate we had computed for the same market 2 years ago. Costs kept on decreasing thanks to the end of the capacity shortage on 12-inch diameter wafers and thanks to standardizing technologies with simplified process flows. And despite technologies improved to the point that the maximum possible die size could be extended, it's not all clear skies for 'fan-in' WLCSP. With the continuous fallout of Nokia on the handsets market, this is WLCSP's historical biggest supporter which loses influence, and some tier two handset manufacturers still seem reluctant to broadly adopt the technology.

1 2 3 4 5 6 Next › Last »