Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“K&S” or the “Company”) announced today that it will be exhibiting at the SMT Hybrid Packaging Show, Europe’s largest event on system integration in microelectronics. Concurrently, K&S will be a featured speaker as it presents technical research at the PCIM Europe show. Both events will be held in Nuremberg, Germany from May 8 – 10, 2012.
Kulicke & Soffa will be at the SMT Hybrid Packaging Show in booth #7-322, exhibiting the advanced capabilities of the Orthodyne 3600Plus Hybrid, Copper-Capable, Wedge Bonder and the Orthodyne 3700Plus Small Wire Wedge Bonder.
K&S will share its latest developments in copper wire bonding and aluminum-clad ribbon bonding and will exhibit these advanced capabilities at the premier trade show. In addition to increasing the reliability of the top-side interconnect during power cycling; copper’s proven advantages over aluminum also include improvements to mechanical strength, current carrying capability and thermal dissipative properties while allowing for higher junction temperatures.
Matt Vorona, Kulicke & Soffa’s Vice President for the Wedge Bond Business Unit, said, “SMT & PCIM have always been valuable platforms for us to reach our target customers in Europe and promote our R&D advancements. These are great opportunities to share our insights and to uncover new opportunities given our industry leadership and dedication to developing next generation hardware and processes to address the industry’s new materials and interconnect needs.”
For the PCIM Europe show, K&S is presenting recently published technical findings during the “Wire Bonds in Power Modules” conference on May 10 at 14:30 CEST. The technical publication titled “Large Cu Wire Wedge Bonding on Wafers with Cu Pad Metallization” was written in collaboration with Atotech Deutschland. People unable to attend the show but interested in receiving a copy of the white paper can download a copy off the K&S website after the show.