SAN JOSE, Calif. and HSINCHU, Taiwan, March 22, 2012 /PRNewswire/ -- Altera Corporation (Nasdaq: ALTR) and TSMC (TWSE: 2330, NYSE: TSM) today announced the joint development of the world's first heterogeneous 3D IC test vehicle using TSMC's Chip-on-Wafer-on-Substrate (CoWoS) integration process. Heterogeneous 3D ICs are one of the innovations enabling the industry's move beyond Moore's Law by stacking various technologies within a single device, including analog, logic and memory. TSMC's integrated CoWoS process provides semiconductor companies developing 3D ICs an end-to-end solution that includes the front-end manufacturing process as well as back-end assembly and test solutions.
Altera And TSMC Jointly Develop World's First Heterogeneous 3D IC Test Vehicle Using CoWoS™ Process
Check Out Our Best Services for Investors
Portfolio Manager Jim Cramer and Director of Research Jack Mohr reveal their investment tactics while giving advanced notice before every trade.
- $2.5+ million portfolio
- Large-cap and dividend focus
- Intraday trade alerts from Cramer
Access the tool that DOMINATES the Russell 2000 and the S&P 500.
- Buy, hold, or sell recommendations for over 4,300 stocks
- Unlimited research reports on your favorite stocks
- A custom stock screener
David Peltier uncovers low dollar stocks with serious upside potential that are flying under Wall Street's radar.
- Model portfolio
- Stocks trading below $10
- Intraday trade alerts
David Peltier identifies the best of breed dividend stocks that will pay a reliable AND significant income stream.
Every recommendation goes through 3 layers of intense scrutinyquantitative, fundamental and technical analysisto maximize profit potential and minimize risk.
Our options trading pros provide over 100 monthly option trading ideas and strategies to help you become a well-seasoned trader.