So, the other area that we’re going to talk a little about in more detail today is wafer scale packaging. We’ve talked, in 2009 we acquired a product line from Zygo. We call the UniFire played a key role in this area and we’re try to help give a little more clarity as to where we fit into our packaging. We’re not so much in a traditional packaging flip chips and putting things on to PC boards.But really when they are packaging the devices either on the, what they called interposer, which is the piece of silicon, where they put two chips side by side still using small micro interconnects, which is shown here an image of one of them or they stack in the devices, one on top of the next. And then in this case we’re looking at through silicon VS. Again we’ve got more slides and some more in content that we will be sharing later today.
Nanometrics' CEO Hosts Analyst Day (Transcript)
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