And finally there is the packaging area. The packaging is going three-dimension, we’ve talked about this before that, so it’s the form factor that drives it. It’s the performance. It’s the power of battery consumption that drives the benefits in terms of going to three-dimensional packaging. And we’ve got a nice presentation. We will talk a little bit more about whether these are involved in the three dimensional packaging, whether you are stacking chips, whether you are putting chips side by side in areas that called inner browsers and so on.
But all of these are important factors that are behind what’s driving our business, the OCD, the displacement, the shrinks, the tighter process allowances, the increasing complexity of the devices and the three dimensional features. So a couple of slides that we’d like to share and this one is the adoption of our OCD inter production. So this is not a market play. This is a Nanometrics deployment of OCD into production.
What’s important is not only is there a high growth rate that’s doubling almost annually, but to take note that where the highest growth is in the smallest technology nodes, the 2x, and 3x nodes. You will see that that one is doubled what it is in the nodes, which intuitively make sense, if anything we are telling to you is aligned with what’s happening.
So as the technology nodes gets smaller as the process tolerances become smaller then the need to make more measurements and to do more across the wafer and to better control the process increases. And so you’ll see this continue to increase and we’re already working on the 1x nodes.Importantly, two for OCD it’s not just a single technology or a single device type technology. You’ll see that we’ve got applications not only in the logic, but we’ve got it in the memory in the DRAM as well as in NAND and even in the hard disk drive that used in the OCD technology for looking at process and process controls in hard disk drives.