Park Electrochemical Corp. (NYSE: PKE) announced the introduction of its new N6800-22 High Speed/Low Loss and N6800-22 SI
High Speed/Very Low Loss digital electronic materials products. N6800-22 and N6800-22 SI are available globally in both prepreg and laminate forms.
N6800-22 and N6800-22 SI offer very advanced electrical performance and very high reliability. N6800-22 has a dissipation factor (Df) of 0.0055 at 10 GHz and 50% resin content (RC) using Open Resonator testing methodology. N6800-22 SI has a Df of 0.0040 at 10 GHz and 50% RC using Open Resonator testing methodology. These very advanced electrical properties allow for high signal speed transfers and reduced transmission loss. N6800-22 and N6800-22 SI are designed for multiple high temperature lead-free assemblies and high layer count printed circuit board designs which require very high levels of reliability. N6800-22 and N6800-22 SI are highly CAF resistant, high Tg materials with low Z-axis expansion. These products have UL 94V-0 designations, meet IPC-4101/91 specifications and are RoHS compliant.
Brian Shore, Park’s President and CEO, said, “I would like to take this opportunity to recognize publicly our R&D groups in Arizona and Singapore for their work in developing our new N6800-22 and N6800-22 SI products, as well as our recently introduced N4800-20 and N4800-20 SI products. Thank you for your fine work in developing these high speed, low loss and very low loss products which may prove to be important products for Park for years to come. Well done.”
For information regarding N6800-22 and N6800-22 SI in North and South America, contact Neltec, Inc. at +1-480-967-5600; for information regarding N6800-22 and N6800-22 SI in Europe, the Middle East, and Africa, contact Neltec SA at +33-562-985290; and for information regarding N6800-22 and N6800-22 SI in Asia and Australia, contact Nelco Products Pte. Ltd. at +65-686-17117.
Certain portions of this press release may be deemed to constitute forward looking statements that are subject to various factors which could cause actual results to differ materially from Park’s expectations. Such factors include, but are not limited to, general conditions in the electronics and aerospace industries, Park’s competitive position, the status of Park’s relationships with its customers, economic conditions in international markets, the cost and availability of raw materials, transportation and utilities, and the various factors set forth in Item 1A “Risk Factors” and under the caption “Factors That May Affect Future Results” after Item 7 of Park’s Annual Report on Form 10-K for the fiscal year ended February 27, 2011.