(NYSE:TER) will present two papers at the
IPC APEX EXPO 2012
technical conference from February 28 through March 1, 2012 in San Diego, California. The papers explain how in-circuit test technologies are evolving beyond traditional test methods to help manufacturers solve the challenges of limited access PCB Assemblies and expensive functional test stages.
“Integrated Electrical Test within the Production Line” describes how new functional test infrastructure, available within modern in-circuit test systems, can be used to replace the “islands of test” found on the typical production floor with more cost-effective single stage test solutions.
“Virtual Access Technique Augments Test Coverage on Limited Access PCB Assemblies” describes how boundary scan and capacitive coupled vectorless test techniques can be combined in an innovative way during in-circuit testing to identify continuity defects on nets that lack physical test access.
“Teradyne's commitment to engineer timely solutions for our test systems addressing the biggest challenges facing today’s manufacturers is reflected in these papers,” said Bobby Griffis, marketing director for Teradyne’s
Commercial Board Test Group
. “The integrated functional test capabilities and virtual access test techniques available in our latest generation of test equipment help manufacturers maintain comprehensive test coverage on limited access PCB Assemblies while reducing the overall cost of test.”
For more information on the TestStation in-circuit product family, visit
(NYSE:TER) is a leading supplier of Automatic Test Equipment used to test semiconductors, wireless products, data storage and complex electronic systems which serve consumer, communications, industrial and government customers. In 2011, Teradyne had sales of $1.4 billion and employs approximately 3,200 people worldwide. For more information, visit
. Teradyne(R) is a registered trademark of Teradyne, Inc. in the U.S. and other countries.