HSINCHU, Taiwan, Dec. 29, 2011 /PRNewswire-Asia/ -- United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced its A+ technology platform, a specialized 0.11um aluminum process manufactured in UMC's 8" fabs. UMC is the only foundry to offer the most complete 0.11um full aluminum BEoL (Back End of Line) process, providing customers with a cost effective alternative to mainstream 0.13um and 0.11um copper technologies. The unique A+ platform consists of a comprehensive blend of technology offerings that no foundry can provide, which include logic/MM, RFCMOS, eFlash, eE2PROM, eHV and CIS to address customers' integration, performance, and cost requirements.
Steve Wang, Vice President of Asian Sales and Corporate Marketing at UMC, said, "There are many applications still enjoying a comfort zone within 8" manufacturing facilities due to the attractive cost vs. performance benefits. For applications such as timing controllers, LCD controllers, remote controller, small panel display drivers, surveillance and medical CMOS Image sensors, etc., A+ is the perfect technology sweet spot. With its comprehensive technology portfolio, the A+ solution offers an ideal migration path for 0.18um or existing 0.13/0.11um Cu-BEoL products so that customers can differentiate their market position for increased competitiveness."
The unique A+ 0.11um specialty platform incorporates state-of-the-art solutions to help designers find an optimal balance between cost, performance, and functionality. A+ combines the most leading-edge 8" production technology with aggressive Al-BEOL design rules. A full suite of IP, HV-LDMOS, I/O devices, RF models and passive components complete the comprehensive A+ offering, with flexible 8-inch manufacturing capacity to support customer production requirements.
About UMCUMC (NYSE: UMC, TSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing services for applications spanning every major sector of the IC industry. UMC's customer-driven foundry solutions allow chip designers to leverage the strength of the company's leading-edge processes, which include production proven 65nm, 45/40nm, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i are both in volume production for a variety of customer products. The company employs approximately 14,000 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com. Note From UMC Concerning Forward-Looking Statements Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information concerning these risks is included in UMC's filings with the U.S. SEC, including on Form F-1, F-3, F-6 and 20-F, each as amended.
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