BEVERLY, Mass., Dec. 5, 2011 /PRNewswire/ -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of innovative, high-productivity solutions for the semiconductor industry, announced today that it will showcase its latest advancements in ion implantation and plasma dry strip technology at SEMICON Japan 2011. The show is being held December 7-9, at the Makuhari Messe in Tokyo, Japan.
- Optima XExTM high energy implanter is the world's #1 high energy system, featuring the broadest energy range and highest beam currents for unmatched productivity. Its unique endstation and LINAC beamline ensures the industry's lowest metals levels, for superior image sensor performance.
- Optima HDxTM high current implanter's enabling spot beam technology combined with its proprietary wafer temperature control delivers higher yields and profitability critical for today's challenging device manufacturing environment. The system features the new Eterna ELS3 source, designed to extend source life by an unprecedented 500% improvement for Carbon, and a 300% improvement for Germanium applications for shallow junctions in sub 2Xnm nodes.
- Optima MDxtTM mid current implanter is an exciting new entrant to the market, delivering unmatched levels of productivity and energy purity across the broadest range of medium current implant applications. Its' precision angle control, patented energy filter and constant focal length scanning minimizes device performance variation, providing the highest yield possible.
- Integra ESTM plasma cleaning system is the only product on the market capable of delivering enhanced device performance benefits with production-proven, non-oxidizing processes, to maximize dopant retention for sub-2Xnm logic devices. The system also features an innovative, modular, cluster design for outstanding manufacturing flexibility and speed for optimized return on your equipment investment.