June 8, 2011
/PRNewswire/ -- Multi-Fineline Electronix, Inc. (Nasdaq: MFLX), announced today that the company has enhanced its manufacturing operations with two new facilities that incorporate additional capacity and state-of-the-art technology. Both new facilities were built on time and within budget to meet future customer demands. MFLEX produces technologically advanced flexible circuits, component assemblies and module assemblies used in smartphones, tablets, and other consumer electronic devices. As one of FORTUNE's 2010 "100 Fastest-Growing Companies," MFLEX will be celebrating its recent achievements by ringing the opening bell at NASDAQ on
June 10, 2011
A global leader in flex circuit fabrication, with complex electronic component assembly, and mechanical integration of intricate components and sensors, MFLEX currently operates in
and multiple locations in
. The two new MFLEX facilities, located in Suzhou and
, together totaling over 900,000 square feet, are now on-line. The new facility in Suzhou will primarily perform flex circuit manufacturing, while the new facility in
will perform component and module assembly.
"MFLEX has operated in
for more than 16 years and achieved success by building a talented workforce and relationships with leading OEM customers in the electronics industry," said
, chief executive officer at MFLEX. "The addition of these two new facilities increases our capacity needed to accommodate expected higher demand from our existing customer base and the expected addition of new OEM customers. The new plants also facilitate the advancement of our technology capabilities to produce the more sophisticated flex assemblies that our OEM customers demand. Upon completing this latest phase of our expansion initiatives, we expect our annual revenue capacity to be
$1.1 to $1.2 billion
by the end of fiscal 2011 and approximately
by mid fiscal 2012."
MFLEX's early supplier involvement during concept and design stages helps OEM's achieve faster time-to-market for new products. MFLEX's supply chain reduction model using a modularization approach with a high level of interaction throughout the product lifecycle enables a consistent and predictable supply chain for global customers. The Chengdu expansion of 290,000 square feet facility increases the Company's component and module assembly capabilities. The Suzhou expansion, a state-of-the-art 610,000 square foot facility, incorporates new roll-to-roll technology capabilities to achieve advanced high density interconnect requirements.