Amtech Systems, Inc. (NASDAQ: ASYS), a global supplier of production and automation systems and related supplies for the manufacture of solar cells, semiconductors, and sapphire and silicon wafers, today announced the appointment of Albert Hasper, Ph.D, to General Manager of Tempress Systems, and the promotion of Brad Anderson to Executive Vice President. Dr. Hasper’s full-time employment will begin July 1, 2011, and he will report to Fokko Pentinga, President of Amtech Systems.
Dr. Hasper has more than 20 years of semiconductor industry experience with career highlights in device and process technologies and senior management roles, most recently as Vice President of Global Operations for ASM International. Within ASM International, he served as Product Manager of ASM’s Vertical Furnace capital equipment product line and as General Manager of ASM Europe. He has authored and co-authored more than 25 journal and conference papers related to the semiconductor and capital equipment markets, and is an inventor on more than 10 U.S. patents in the areas of CVD and ALD deposition and capital equipment design. Dr. Hasper received his M.S. and Ph.D degrees in Electrical Engineering from the University of Twente, the Netherlands.
J.S. Whang, Chief Executive Officer of Amtech, commented, “I am very pleased to have Albert Hasper join Amtech and further strengthen our management and technology capabilities. His successful track record in the semiconductor capital equipment markets as a senior operating officer will be a valuable asset to the company as we continue to execute our growth strategies. This strengthening of our management depth will assist Fokko Pentinga in his role as President of Amtech Systems and, coupled with the promotion of Brad Anderson to Executive Vice President, puts us in a great position to more fully capitalize on external growth opportunities and organic innovation.”
About Amtech Systems, Inc.Amtech Systems, Inc. manufactures capital equipment, including silicon wafer handling automation, thermal processing equipment and related consumables used in fabricating solar cells, LED and semiconductor devices. Semiconductors, or semiconductor chips, are fabricated on silicon wafer substrates, sliced from ingots, and are part of the circuitry, or electronic components, of many products including solar cells, computers, telecommunications devices, automotive products, consumer goods, and industrial automation and control systems. The Company’s wafer handling, thermal processing and consumable products currently address the diffusion, oxidation, and deposition steps used in the fabrication of solar cells, LEDs, semiconductors, MEMS and the polishing of newly sliced silicon wafers.
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