Feb. 15, 2011
/PRNewswire/ -- RF Micro Devices, Inc. (Nasdaq: RFMD), a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, today announced that RFMD's PowerSmart™ power platforms and WiFi front end modules have been selected by LG to enable a broad portfolio of next-generation 3G/4G smartphones, including the LG Optimus 3D – the world's first full 3D smartphone. The LG Optimus 3D was unveiled Monday at Mobile World Congress 2011 in
, president and CEO of RFMD, said, "RFMD is pleased to support LG's popular Optimus product family, and we're proud our PowerSmart power platforms and WiFi components are featured in such an innovative device as the Optimus 3D. We believe our PowerSmart power platforms lead a product category that is reshaping the future of multimode, multi-band cellular RF architectures, and we look forward to further leveraging our product and technology leadership across LG's growing 3G/4G product portfolio."
PowerSmart power platforms feature a revolutionary new RF Configurable Power Core™ that delivers multiband, multi-mode coverage of all cellular communications modulation schemes, including 2G, 3G and 4G, up to LTE 64QAM. In addition to the RF Configurable Power Core, RFMD's PowerSmart power platforms also include all necessary switching and signal conditioning functionality in a compact reference design, providing smartphone manufacturers a single scalable source for the entire cellular front end.
With today's announcement, RFMD's PowerSmart power platforms are now in production in support of multiple families of flagship 3G/4G smartphones and tablet devices, supporting the Company's expectations that PowerSmart power platforms satisfy its customers' most stringent RF performance requirements.
RFMD's RF3482 WiFi front end module satisfies smartphone and tablet manufacturers' requirements for aggressive size reductions in 802.11b/g/n front end solutions, while delivering high linear output power and greatly reducing the number of components outside the core connectivity chipset. Shipments of RFMD's PowerSmart power platforms and high-performance WiFi components are expected to increase sequentially throughout the year.