BARCELONA, Spain, Feb. 14, 2011 /PRNewswire/ -- RF Micro Devices, Inc. (Nasdaq GS: RFMD), a global leader in the design and manufacture of high-performance radio frequency components and compound semiconductor technologies, today announced availability of the Company's RF724x family of HSPA+ power amplifiers. RFMD's RF724x power amplifiers are ultra-high efficiency, single-mode 3G/4G components that reset the bar for performance in smartphones, tablets, and other high-performance data-centric connected devices.
RFMD's RF724x power amplifiers support ultra-high peak efficiency of 48%-51%, significantly above current competitive offerings. Additionally, when combined with one of RFMD's companion DC-DC converters or with chipsets featuring on-chip DC-DC converter functionality, RFMD's RF724x power amplifiers can deliver best-in-class DG.09 performance as low as 13 mA – directly translating into superior 3G talk time. RFMD's RF724x product family is comprised of five PAs covering WCDMA bands 1, 2, 4, 5 and 8, addressing the most common 3G/4G frequency bands and band combinations.
Eric Creviston, president of RFMD's Cellular Products Group (CPG), said, "RFMD's RF724x power amplifiers are specifically designed to reduce the thermal impact of data usage in smartphones while enabling increased battery life during data-based applications like web surfing, video calls and internet radio services. We anticipate significant customer adoption this year, and we expect our first production shipments will commence for a leading North American smartphone manufacturer later this quarter."
All RF724x power amplifiers are packaged in a standardized 3x3 mm footprint, significantly improving smartphone platform flexibility and ease of implementation. RFMD's RF724x power amplifiers also feature an integrated high directivity coupler, standard 2-bit GPIO control logic, and low insertion phase shift between bias states.RFMD offers a broad portfolio of 3G solutions in single-mode and multimode converged and hybrid architectures to ensure compatibility with leading chipset providers and enable global platform manufacturing.