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Viasystems Achieves AS9100 Aerospace Certification In Huiyang Printed Circuit Board Facility

Viasystems Group, Inc. (NASDAQ:VIAS) announced that its printed circuit board (PCB) manufacturing facility in Huiyang, China, has achieved AS9100 certification, the standardized quality management accreditation for the aerospace industry. The Huiyang facility passed rigorous audits to demonstrate that its manufacturing processes meet the high standards of the aerospace industry.

“Earning the AS9100 designation for our Huiyang facility demonstrates that we are a highly capable supplier to the aerospace electronics industry around the globe,” said David M. Sindelar, Chief Executive Officer of Viasystems. “With certified plants in both the United States and China, we have complete product life-cycle capability for the aerospace industry, from quick-turn PCB prototypes through the ramp-up of volume to low-cost-region manufacturing.”

Viasystems’ plant in Forest Grove, Oregon, also has AS9100 certification along with Nadcap accreditation, ITAR certification, and MIL-PRF certifications.

Forward Looking Statements

Certain statements in this communication may constitute “forward-looking statements” within the meaning of the Private Securities Litigation Reform Act of 1995. These statements are made on the basis of the current beliefs, expectations and assumptions of the management of Viasystems regarding future events and are subject to significant risks and uncertainty. Investors are cautioned not to place undue reliance on any such forward-looking statements, which speak only as of the date they are made. Viasystems undertakes no obligation to update or revise these statements, whether as a result of new information, future events or otherwise. Actual results may differ materially from those expressed or implied. Such differences may result from a variety of factors, including but not limited to: legal or regulatory proceedings; any actions taken by the Company, including but not limited to, restructuring or strategic initiatives (including capital investments or asset acquisitions or dispositions); or developments beyond the Company’s control, including but not limited to, changes in domestic or global economic conditions, competitive conditions and consumer preferences, adverse weather conditions or natural disasters, health concerns, international, political or military developments, and technological developments. Additional factors that may cause results to differ materially from those described in the forward-looking statements are set forth under the heading “Item 1A. Risk Factors,” in the annual report on form 10-K filed by Viasystems with the SEC on February 25, 2010 and in Viasystems’ other filings made from time to time with the SEC and available at the SEC’s website, www.sec.gov.

About Viasystems

Viasystems Group, Inc. is a technology leader and a worldwide provider of complex multi-layer, printed circuit boards (PCBs) and electro-mechanical solutions (E-M Solutions). Its PCBs serve as the “electronic backbone” of electronic equipment, and its E-M Solutions products and services integrate PCBs and other components into electronic equipment, including metal enclosures, cabinets, racks and sub-racks, backplanes, cable assemblies and busbars. Viasystems’ 14,800 employees around the world serve more than 800 customers in the automotive, industrial and instrumentation, telecom, computer/datacom and military/aerospace end markets. For additional information about Viasystems, please visit the Company’s website at www.viasystems.com.



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