FREMONT, Calif., Jan. 6, 2011 (GLOBE NEWSWIRE) -- Aehr Test Systems (Nasdaq:AEHR), a worldwide supplier of semiconductor test and burn-in equipment, today announced financial results for the second quarter ended November 30, 2010.
Net sales were $3.6 million in the second quarter of fiscal 2011, compared with $1.6 million in the second quarter of fiscal 2010. Aehr Test reported a net loss of $0.8 million, or $0.09 per diluted share, in the second quarter of fiscal 2011. This compares to a loss of $2.2 million, or $0.25 per diluted share, in the second quarter of fiscal 2010. Included in the results for the second quarter of fiscal 2011 was the receipt of a dividend payment of $0.6 million related to a long-term investment reported in other income.
Commenting on the results of the second quarter of fiscal 2011, Rhea Posedel, chairman and chief executive officer of Aehr Test Systems, said, "At the top line, net sales of $3.6 million more than doubled when compared to the second quarter of last year. During the quarter, we benefitted from the revenue recognized from previously announced orders of approximately $2 million for multiple FOX™-1 WaferPak contactors from a leading manufacturer of semiconductor memory devices. In addition, we recently announced that this customer placed more orders for additional WaferPak contactors totaling approximately $3 million. We believe these new WaferPak orders validate the cost saving advantages of using our FOX-1 tester, which can test a full wafer with thousands of die in a single touchdown."We are pleased to announce that we have completed the development and shipped a new Advanced Burn-in and Test System (ABTS™) to a major Japanese IC manufacturer. This new ABTS system is targeting production test and burn in of microcontrollers for automotive and high end consumer applications. We also received an order during the quarter from a leading U.S. military defense customer for our newly configured ABTS. This production configuration of the ABTS system was chosen for its 72 burn-in board capacity and its ability to burn-in and test future higher pin-count ASIC and custom logic devices.