Cascade Microtech, Inc. (NASDAQ:CSCD), a worldwide leader in the precise electrical and mechanical measurement and test of integrated circuits (ICs) and other small structures and SUSS MicroTec AG (FWB:SMH)(GER:SMH)(ISIN: DE0007226706), a leading supplier of equipment and process solutions for the semiconductor industry and related markets announced today that they have entered into a strategic partnership to address the growing device complexities of emerging semiconductor technologies such as 3D TSV manufacturing and test.
Over the last few decades Moore’s Law (the doubling of device performance every two years) has enabled the semiconductor companies to increase speed, functionality and complexity while reducing cost at the same time. As companies are driving beyond 32 nm, the cost position becomes less favorable and interconnect technology is limiting performance gains. Emerging 3D methodologies (the stacking of one die or wafer on top of another) are addressing these dilemmas. Adoption of 3D TSV (Through-Silicon Via) is the ultimate in 3D integration providing higher performance, reduced noise, smaller device form factor, and modularity in construction at potentially lower cost.
By forming a strategic alliance, the two companies will bring innovative approaches to the 3D TSV manufacturing processes. Both companies will use their associations with leading research organizations such as IMEC, as well as industry partnerships, to gain insight into this cutting-edge methodology driving beyond Moore’s Law. Further collaboration with device and reliability experts will allow the alliance to address the complexities and interactions of semiconductor bonding and test probing for next-generation semiconductor devices.
"SUSS MicroTec shares Cascade Microtech’s commitment to develop the most advanced technologies for the continued improvement of semiconductor technologies," said Frank P. Averdung, President and CEO of SUSS MicroTec AG. "The comprehensive knowledge of the two companies will enable both companies to better address the issues inherent in 3D Integration."
"This joint research initiative with SUSS MicroTec reinforces Cascade Microtech’s commitment to develop practical solutions for leading-edge technologies that increasingly rely on new structures for continued performance improvement," said F. Paul Carlson, Chairman and CEO of Cascade Microtech, Inc. "We look forward to collaborating with SUSS MicroTec on innovative ways to characterize and evaluate new design methodologies and manufacturing processes, which will benefit our common customers, as well as the industries we serve."