IBM Chips Get 3D Tech

While IBM has been working on the technology for nearly 10 years in the lab, the company says it has figured out a way to build chips with 3D features in its existing chip-fabrication facilities.

"The breakthrough is that we've been doing this in the manufacturing line," said Lisa Su, vice president of semiconductor research and development at IBM. That opens up the potential to manufacture various kinds of chips using 3D technology in large volumes.

IBM's 3D chip-stacking technology will make its debut in power amplifier chips used in cell-phone and wireless networking products. IBM said it will sample the chips in the second half of the year with production slated for 2008.

In the case of power amplifiers, eliminating the excess wiring means the chip will pick up less stray noise and signals, resulting in better battery life.

But applying 3D technology to other types of chips could lead to big gains in performance without increasing the chip's footprint.

Su said that IBM was interested in applying 3D technology to more complex chips in the future, such as microprocessors, which she predicted was still three to five years out.

"It really is a technology that can be used across a wide set of applications," said Su. "So it's a single innovation that has a lot of different avenues to explore."

Shares of IBM closed Wednesday's regular session off $1.30 to $95.16.

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